What is the Bond Test Process
Introduction:- A Bond Test Process is performed to determine the strength of an adhesive to hold together two materials while being stressed. After the bond has been applied, it is tested the strength of the bond by exerting force on the adhesive …
What is the Wire Bond Process?
Introduction:- Wire Bonding is the technique of establishing the electrical connections between a silicon chip and the external leads of a semiconductor device using very fine bonding wire during semiconductor device fabrication. These wires are made of materials such as Copper (Cu), …
What is the Die Attach process?
Introduction: Die Attach is also commonly known in the Semiconductor industry as Die Bonding or Die Mount. It is the process of attaching a silicon chip to the Die pad of the support structure, such as a leadframe or metal can header …
