What is DTFS Process?
Semiconductors are the fundamental building blocks of the electronics industry. These partly conductive goods include transistors, processors, and other electronic control pieces that are used in everything from mobile phones to automobiles and robots. Today, most semiconductor chips are made from silicon …
Saw Dicing vs Laser Dicing vs Plasma Dicing vs Scribing Dicing
In this article, we compare the differences between Saw Dicing, Laser Dicing, Plasma Dicing, and Scribing Dicing. The thin wafer dicing equipment market may be divided into four categories based on dicing technology: Wafer Scribing and Breaking Saw Dicing Laser Dicing Plasma …
What is Dicing Process?
There are various steps involved in the Dicing process listed below: Wafer Mount to the Tape Frame Dicing Process Through blades Wafer Microwash Process Wafer Inspection and Die Sorting The below image is showing the flow diagram of the Dicing process. What …
What is the Bond Test Process
Introduction:- A Bond Test Process is performed to determine the strength of an adhesive to hold together two materials while being stressed. After the bond has been applied, it is tested the strength of the bond by exerting force on the adhesive …
What is the Wire Bond Process?
Introduction:- Wire Bonding is the technique of establishing the electrical connections between a silicon chip and the external leads of a semiconductor device using very fine bonding wire during semiconductor device fabrication. These wires are made of materials such as Copper (Cu), …
What is the Die Attach process?
Introduction: Die Attach is also commonly known in the Semiconductor industry as Die Bonding or Die Mount. It is the process of attaching a silicon chip to the Die pad of the support structure, such as a leadframe or metal can header …
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