Description
Engineering Plastic Groove Tips are specifically designed for thin die applications with die thickness ≤0.1mm. Tips used for Thin die applications require stable vacuum force while maximizing tip to die or device surface contact area.
The design of our Groove Tips features a central vacuum hole, connected to multiple vacuum channeling grooves on the surface of the tip, which enhance seven and distributed suction force coverage to specific areas of the die or device. Our proprietary groove designs help to hold the thin dies gently and securely during the application process.
Oricus manufactures a wide range of customized Groove Tips with sizes and configurations designed to suit your application. We have the capabilities to machine micro grooves with widths as narrow as 0.2mm.
Features
- Offers a regulated suction program to maximize suction force and tip to die contact
- Can be made in Round, Square, Rectangular and Custom outer profiles with different groove designs
- Groove options available between X profiles, Plus profiles, Asterisk profiles, Multi-Groove profiles or Scattered profiles
- Certain models of Engineering Plastics with E6-E9 Static Dissipative properties to ensure proper Electrostatic Discharge
- Harder than Rubber and softer than Steel/Carbide Groove Tips
- Higher wear resistance as compared to Rubber and lower wear resistance as compared to Steel/Carbide Groove Tips
- Higher temperature resistance as compared to Rubber and lower temperature resistance as compared to Steel/Carbide Groove Tips
Benefits
- Minimizes the formation of voids on the substrate after the thin die has been placed or bonded
- Provides distributed vacuum forces to selected locations of dies or devices
- Compared to Flat Tips or Vacuum Relief designs, Groove Tips offers a balanced mix of surface contact and vacuum suction
- Engineering Plastic Groove Tips are more forgiving when less than optimal bond force is applied and will be less likely to damage the die or die surface as compared to Steel or Carbide Groove Tips
Material Information
Each and every material selected for use in our products go through a stringent Selection, Development, and Assessment process. In-house developed compounds are developed with the latest innovations in material technology and feature formulations that are designed specially for use in the Semiconductor industry. For externally procured materials, each material goes through a rigorous Quality Assurance and Performance Assessment programme before being qualified for use in our products.
| Material Description | Hardness | ESD Surface Resistance (Ω) | Service Temperatures (Deg C) | |
|---|---|---|---|---|
| Engineering Plastics (EP) | Polycarbonate | Rockwell M18-99/M65 - 122 | Insulative (>E10) | >85/130 |
| TECAFORM SD | Ball indentation 74 Mpa | Static Dissipative (E9 - E11 ) | 100 | |
| Delrin (ESD) | Rockwell M75 | Conductive (< E5) | 107 | |
| Delrin (Black) | Rockwell M89,R122 | Insulative (>E10) | 121 | |
| Delrin (White) | Ball indentation 185 MPa | Insulative (>E10) | 110 | |
| POM | Rockwell M75 - 94 | Insulative (>E10) | 100 | |
| PEEK | Rockwell M55 - 100 | Insulative (>E10) | 260 | |
| PEEK HT | Rockwell M100 | Insulative (>E10) | 260 | |
| PEEK GF 30% | Rockwell M70 - 103 | Insulative (>E10) | 260 | |
| PEEK CF 30% | Rockwell M70 - 107 (298 MPa) | Static Dissipative (E6 to E9) | 260 | |
| Performance Engineering Plastics (SP) | Torlon 4435 (PAI ESD) | Rockwell M106, E62 | Static Dissipative (E6 to E9) | 278 |
| Torlon 4301 (PAI) | Rockwell E70 - 72 | Insulative (>E10) | 279 | |
| Torlon 5030 (PAI) | Rockwell E90 - 94 | Insulative (>E10) | 278 | |
| Torlon 7130 (PAI) | Rockwell E91 - 94 | Conductive (< E5) | 282 | |
| Vespel SCP5050 (PI) | Rockwell E63 | Conductive (< E5) | 300 | |
| Vespel SP-21 (PI) | Rockwell E25-45 | Insulative (>E10) | 310 | |
| Vespel SP-1 (PI) | Rockwell E45-60 | Insulative (>E10) | 300 | |
| ESD Semitron 520 | Rockwell M110, E73 | Static Dissipative (E10 to E12) | 250 | |
| ESD Semitron 420 | Rockwell M118 | Static Dissipative (E6 to E9) | 171 | |
| ESD Semitron 410C | Rockwell M115 | Static Dissipative (E4 to E6) | 170 | |
| ESD Semitron 225 | Rockwell M106 | Static Dissipative (E9 - E10) | 90 |
Product Information
Standard Sizes
| Part Number | X (mm) | Y (mm) |
|---|---|---|
| PS-EBGX-UD01-04000400-01 | 4.00 | 4.00 |
| PS-EBGX-UD01-06000600-01 | 6.00 | 6.00 |
| PS-EBGX-UD01-08000800-01 | 8.00 | 8.00 |
| PS-EBGX-UD01-10001000-01 | 10.00 | 10.00 |
Customized Designs
If you are unable to find a size that fits your application from our catalog, get in touch with us and our Application Experts will provide you with a customized turnkey solution according to your die size, process and application.
Part Numbers And Ordering
Code
Code
- W –Hybrid Carbide
- V – Full Carbide
- Y – Superalloys
- L – Stainless Steels
- S – Steels
- F – Non-Ferrous
- E – Engineering Plastics
- P - Performance Engineering Plastics
Grade
Code
- F – Flat
- R – Relief
- G – Groove
- M – Multi-Hole
- C – Side Clamp
Code
Make
- AP - Alphasem
- AS – ASM
- CA – Canon Bestem
- DA – Datacon
- EE – ESEC
- EM – EMTEC
- HA – Hitachi
- MR – MRSI
- PA – Palomar
- SR - Shibaura
- SW – Shinkawa
- UD – Universal Design
4 digit code 1590 = 15.9mm For OD:
4 digit code 0800 = 8mm
Tip ID Code
4 digit code 0518 = 5.18mm For ID:
4 digit code 0600 = 6mm
Version
