Ball Bonding Overview
Wire bonding is an interconnect process of creating electrical connections between integrated circuits and substrates using bonding wires. Pressure, ultrasonic energy and heat are used for a solid state weld between the integrated circuits and substrates.
The two most common processes are Ball Bonding (Gold/Copper) and Wedge bonding (Aluminium). Ball Bonding offers higher speeds and throughput compared to Wedge Bonding due to the process being non directional. This has led to Ball Bonding being widely selected as the process of choice for plastic based packaging
We manufacture Window Clamp Inserts and Heat Block Inserts used in the Ball Bonding Process, Finger Clamps & Bridges and Anvil Blocks used in the Wedge Bonding process.