Bond Test Overview
Bond Testing and Inspection refers to the tests performed after the Die Attach and/or Wire Bond process to determine the integrity and reliability of the bonded integrated circuits. Four main types of Tests and Inspection are performed:
Visual Test and Inspection
Visual techniques using Automated Optical Inspection equipment are used to verify that proper Ball Bonds and Wedge Bonds have been formed according to process design. In addition, the Visual Test and Inspection process also verifies that the bonds have been properly located in relation to the bond pads and the fingers of the leadframe and/or substrate.
Die Shear Testing, alternatively known as Package Shear Testing is a shear test that utilizes high force to determine the strength of adhesion between the bonded die and the underlying substrate. It is an ideal method for measuring glue, solder and sintered silver bonded areas. Die Shear Testing is a widely implemented method that is ideal for Adhesive, Solder and silver Sintered bonds.
Die Shear Tests can be performed with a few grams of force up to 1000 kilograms of force. Die Shear Tests are also suitable for Ultra Thin Dies and Flip Chip Ball Grid Arrays.
Our self aligning Die Shear Tools can help eliminate issues with cracked dies during test.
Ball Shear Test
Ball Shear Test is a process for the evaluation of a Ball Bond’s quality. Data retrieved post Ball Shear Testing illustrates the intermetallic formation and the coverage of the bonds.
Test data from Ball Shear Testing such as the Bond Strength and Failure Modes are used to evaluate the quality of a Ball Bond.
Wire Pull Test
Wire Pull Testing applies an upward force from underneath the bonded wire, creating a force that pulls the wire away from the substrate. Test data from Wire Pull Testing such as the Bond Strength and Failure Modes are used to evaluate the quality of the Wire Bond.